Following the initial teardown photos, TechOnline has identified each chip component on the iPhone 3G motherboard -- including the associated manufacturers and functionalities of each. The report says that choices are surprising for some of the upgraded communication components and outside of some basic design tweaks, the iPhone 3G is very similar to the original iPhone. The report says that Infineon made four key design wins with the new iPhone 3G and that it usses Toshiba rather than Samsung memory, leading analysts to question whether the huge memory deal with Samsung is still in place. The report notes that one of the big differentiators of the new iPhone device is its built-in GPS capability, which is provided by yet another Infineon chip, the PMB 2525 Hammerhead II: "In the old one [original iPhone], GPS was software enabled and was accurate to within blocks," the publication quoted one analyst as saying. "This time it's accurate to within meters."
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