"The addition of 3G wireless capability represents an evolutionary design step for the iPhone, not a revolutionary one," said Andrew Rassweiler, teardown services manager and principal analyst at iSuppli. "iSuppli believes Apple aimed for a more cost-effective design for the 3G iPhone compared to the 2G, in order to lower the retail price�which will allow the company to seed adoption and to capture maximum market share now�while the company still has buzz and a perceived differentiation relative to its competitors."
iSuppli confirms that an Infineon AG chipset does power the unit, with Samsung, Marvell, and Cambridge also putting major components into the iPhone 3G. Cost and quality were optimized as Apple elected to use once circuit board for the phone, over the two that were previously in the device, while also making use of a 10-layer board.
All things considered, iSuppli finds that overall, based on the selling price of the 8GB model, Apple stands to reap a margin of approximately 55-percent.
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